《stm32h750VBT6_datasheet》pdf电子书免费下载
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《stm32h750VBT6_datasheet》介绍
Real-timeclock(RTC) ， backupS RAM and backup registers.Inter-integrated circuit interface(1c) .Universal synchronous/asynchronous receiver transmitter(US ART) .Low-power universal asynchronous receiver transmitter(LP UART) . 46Serial peripheral interfaces(SPI) integrated inter chipsound interfaces(I2S) .，47Serial audio interfaces(SAI) .47SPDIF RX Receiver Interface(SPDIF RX) .48Single wire protocol master interface(SW PM I)，48Management Data In pu/Output(MDIO) slaves49SD/SDIO/MMC card host interfaces(SD MMC) .49Controller area network(FD CAN 1， FD CAN 2) .49Universal serial bus on-the-go high-speed(OTG_HS) .50Ethernet MAC interface with dedicated DMA controller(ETH) .50High-defintion multimedia interface(HDMI)-consumer electronics control(CEC) .51Debug infrastructure.51
DescriptionSTM32H750xB devices are based on the high-performance Arm°Cortex*-M 732-bit RISccore operating atupto480MHz.The Cortex-M7core features a floating point unit(FPU)which supports Arm double-precision(IEEE754compiant) and single-precision data-processing instructions and datatypes.STM32H750xB devices support a full set of DSPinstructions and a memory protection unit(MPU) to enhance application security.STM32H750xB devices incorporate high-speed embedded memories with a Flashmemoryof 128K bytes， upto1MbyteofRAM(including 192KbytesofTCMRAM， upto864K bytesof userS RAMand4K bytes of backupS RAM) ， as well as an extensive range of enhancedV/Os and peripherals connected to APB buses， AHB buses， 2x 32-bit muliA HB bus matrixand a multilayer AXl interconnect supporting internal and exte mal memory access.All the devices offer three ADCs， two DACs， two ultra-low power comparators， a low-powerRTC， a high-resolution timer， 12 general-purpose 16-bit timers， two PWM timers for motorcontrol， five low-power timers， a true random number generator(RNG) ， and a cryptographicacceleration cell.The devices support four digital filters for external sigma-delta modulators(DFS DM) .They also feature standard and advanced communication interfaces.RefertoTable1：STM32H750xBleaturesandperipheralcountsforthelistofperipheralsavailable on each part number.
EthernetSTM32H750xB devices operate in the -40 to+85C temperature range from a 1.62 to3.6V powersupply.The supply voltage can dropdown to 1.62Vby using an external powersupervisor(see Section 3.5.2.Powersupply supervisor J and connec ing the PDR_ON pintoVsg.Otherwise the supply voltage must stay above 1.71V with the embedded powervoltage detector enabled.Dedicated supply inputs for USB(OTG_FS and OTG_HS) are available on all packagesexcept LQFP100toallowa greater powersupply choice.A comprehensive set of power-saving modes allows the design of low-power applicationsSTM32H750xB devices are offered in 3 packages ranging from 100pinsto240pins/balls.The set of included peripherals changes with the device chosen.These features makeS TM32H750xB microcontrollers suitable for a wide range of
《stm32h750VBT6_datasheet》目录
Arm Crtex*-M7withFPU.
Memry prtectin unit(MPU) .
Memries.
3.3.1Embedded Flashmemry.
3.3.2Secure access mde.
3.3.3Embedded SRAM.
Bt mdes，
Pwersupply management.
3.5.1Pwersupply scheme.
3.5.2Pwersupply supervisr.
3.5.3Vltage regulatr.
Lw-pwer strategy.
Reset and clck cntrller(RCC) .
3.7.1Clck management.
3.7.2System reset surces.
General purpse input/utputs(GP ls) .
Bus-intercnnect matrix.
DMA cntrllers.
Chrm-ART Acceleratr(DMA2D) .
Nested vectred interrupt cntrller(NVIC) .
Extended interrupt and event cntrller(EXT I) .
Cyclic redundancy check calculatin unit(CRC) .
Flexible memry cntrller(FMC).
Quad-SPI memry interface(QUAD SPI)
Analg-t-digital cnverters(ADCs) .
Temperature sensr，
VB AT peratin.
Digital t-analg cnverters(DAC) .
Ultra-lw-pwer cmparatrs(CMP)
peratinal ampli iers(PAMP)
Digital filter fr sigma-delta mdulatrs(DFS DM) .
Digitalcamera interface(DCMI) .
LCD-TFT cntrller.
JPEG Cdec(JPEG) .
Randm number generatr(RNG) .
Cryptgraphic acceleratin(CRYP and HASH) .
Timers and watchdgs.
3.29.1High-reslutin timer(HR TIM 1) .
3.29.2Advanced-cntrl timers(TIM 1， TIM 8)
3.29.3General purpse timers(TIM x) .
3.29.4Basic time rsTIM6andTIM 7.
Lw-pwer timers(LP TIM 1， LP TIM 2， LP TIM 3.LP TIM 4， LP TIM 5) . 43
Independent watchdg.43
Windw watchdg.43
Sy sTick timer.43
Real-timeclck(RTC) ， backupS RAM and backup registers.
Inter-integrated circuit interface(1c) .
Universal synchrnus/asynchrnus receiver transmitter(US ART) .
Lw-pwer universal asynchrnus receiver transmitter(LP UART) . 46
Serial peripheral interfaces(SPI) integrated inter chip
sund interfaces(I2S) .，47
Serial audi interfaces(SAI) .47
SPDIF RX Receiver Interface(SPDIF RX) .48
Single wire prtcl master interface(SW PM I)，48
Management Data In pu/utput(MDI) slaves49
SD/SDI/MMC card hst interfaces(SD MMC) .49
Cntrller area netwrk(FD CAN 1， FD CAN 2) .49
Universal serial bus n-the-g high-speed(TG_HS) .50
Ethernet MAC interface with dedicated DMA cntrller(ETH) .50
High-defintin multimedia interface(HDMI)
-cnsumer electrnics cntrl(CEC) .51
Debug infrastructure.51
STM32H750VBSTM32H 750 ZBSTM32H750IBSTM32H750XB
4Memry mapping.
5Pin descriptins
6Electrical characteristics(rev Y)
perating cnditins at pwer-up/pwer-dwn.
Embedded reset and pwer cntrl blck characteristics.
Embedded reference vltage.
Supply current characteristics.
Wakeup time frm lw-pwer mdes.
Exte mal clcksurce characteristics.
Internal clcksurce characteristics.
PLL characteristics.
Memry characteristics.
EMC characteristics.
Abslute maximum ratings(electrical sensitivity) .
// current injectin characteristics.
// prt characteristics.
NR STp in characteristics.
FMC characteristics.
Quad-SPI interface characteristics
Delay blck(DLY B) characteristics.
16-bit ADC characteristics.
DAC electrical characteristics
Vltage reference buffer characteristics
Temperature sensr characteristics.
Temperature and Ve AT mnitring.-
Vltage bster fr analg switch.
Cmparatr characteristics.
peratinal amplifier characteristics.
DS12556Rev 5
STM32H750VBSTM32H 750 ZBSTM32H750IBSTM32H750XB
DS12556Rev 5ST
Digital filter fr Sigma-Delta Mdulatrs(DFS DM) characteristics . 176
Camera interface(DCMI) timing speci icatins.178
LCD-TFT cntrller(LTD C) characteristics.179
Timer characteristics.181
Cmmunicatins interfaces.182
JTAG/SWD interface characteristics.196
Minimum and maximum values.，199
Typical values.199
Typical cur vs.199
Lading capacitr.199
Pin input vltage.199
Pwersupply scheme.200
Current cnsump tn measurement.201
General perating cnditins.203
VCAP external capacitr.205
perating cnditins at pwer-up/pwer-dwn.205
Embedded reset and pwer cntrl blck characteristics.206
Embedded reference vltage.207
Supply current characteristics.208
Wakeup time frm lw-pwer mdes.220
Exter al clcksurce characteristics.221
Internal clcksurce characteristics.225
PLL characteristics.228
Memry characteristics230
EMC characteristics.231
Abslute maximum ratings(electrical sensi tv ity) .233
I/ current injectin characteristics.234
Electrical characteristics(rev V)
7.1Parameter cnditins.
7.2Abslute maximum ratings.
7.3perating cnditins.
STM32H750VBSTM32H 750 ZBSTM32H750IBSTM32H750XB
8Package infrmatin.
9rdering infrmatin
10Revisin histry
I/ prt characteristics.
NR STp in characteristics.
FMC characteristics.
Quad-SPlinter face characteristics.
Delay blck(DLY B) characteristics.
16-bit ADC characteristics.
DAC characteristics.
Vltage reference buffer characteristics
Temperature sensr characteristics.
Temperature and VeAr mnitring.
Vltage bster fr analg switch.
Cmparatr characteristics.
peratinal ampli ier characteristics.
LQFP 100 package infrmatin.
LQFP 144 package infrmatin.
LQFP 176 package infrmatin.
U FBGA 176+ 25 package infrmatin.
T FBGA 240+ 25 package infrmatin
Thermal characteristics.
8.6.1Reference dcument.
DS12556Rev 5
STM32H750VBSTM32H 750 ZBSTM32H750IBSTM32H750XB
DS12556Rev 5
STM32H750xB features and peripheral cunts.
System vs dmain lw-pwer mde.
DFS DM implementatin.
T mer feature cmparisn.4.-
US ART fea